The International Conference on
Compound Semiconductor Manufacturing Technology

"Sharing Ideas Throughout the Industry"
 2010 Conference Workshops
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Full document in PDF format
Workshop Session 1
Process Flow, Process Integration and Testing Overview
 
Ravi Ramanathan, Skyworks Solutions, Inc
Workshop Session 2
Substrates and Epitaxy in III-V Manufacturing
 
 Bob Yanka, RF Micro Devices
Workshop Session 3
Front End of Line (FEOL) Device Processing
 
Shiban Tiku, Skyworks Solutions, Inc
Workshop Session 4
Device Processing in III-V Manufacturing:  Front-side Backend Processing
 
Jan Campbell from TriQuint Semiconductor
Workshop Session 5
Device Processing in III-V Manufacturing: Backside Wafer Processing
 
Tim Whetten, Avago Technologies
Workshop Session 6
Device Processing in III-V Manufacturing:  Front-side Backend Processing Wafer-Level Packaging and Wafer-Scale Assembly Technologies

 Patty Chang-Chien, Northrop Grumman Aerospace Systems