Manufacturable
Commercial 4-inch InP HBT Device Technology
N. X. Nguyen, J. Fierro, G. Peng, A. Ly, and C. Nguyen
Global Communication Semiconductors, Inc.
23155 Kashiwa Court, Torrance, CA 90505
Email: nnguyen@gcsincorp.com; Phone: 1-310-530-7274 x166
Abstract
A manufacturable, reliable, and high performance InP
Heterostructure Bipolar Transistors device technology (SHBT and DHBT) has been
developed and being offered for commercial foundry services. These devices are
ideal to provide a complete chipset for 40 Gb/s fiber optic communication
(OC-768) as well as high performance power amplifiers for 3G wireless
applications. A peak cutoff frequency, Ft, of over 200 GHz was obtained for
non-self aligned 1X3 _ m 2 device. The devices were designed for high reliability
by employing an Al-free (InP) emitter and a carbon-doped base. Excellent device
yield and uniformity observed across the wafer clearly demonstrated the
feasibility of this technology for MSI-level of integration required in
MUX/DMUX communication circuits.