Thermal Management of High Power Devices

J. Laskar, S. Nuttinck, and S. Pinel

Georgia Electronic Design Center, School of E.C.E., Georgia Institute of Technology Atlanta, GA 30332

Email: pinel@ece.gatec.edu – Tel: 404 385 6009

Keywords: power devices, thermal effects, micro-channels

Abstract

We report in this paper the thermal effects onto the performances of high power microwave transistors. Also, thermal simulation results along with means to optimize the heat dissipation on a wafer level are discussed. Finally we present a novel active thermal management technique using micro-fluidic channels. The simple fabrication process is presented.

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