Luo JunHua, Yao JingZhong, Xu XueSong, Adhihetty Indira
Wireless and Packaging System Laboratory
Technology Solutions Organization
Freescale Semiconductor (China) Limited No.15 Xinghua Avenue, Xiqing Economic Development Area, Tianjin, China
Keywords: Delamination, Solder Paste, Solder Wire, TOF-SIMS, XPS
Delamination is the most common reliability issue of IC and will cause severe damage to function/life. In this paper, TOF-SIMS and XPS were taken to analyze the chemical status of leadframe surfaces with different die bonding processes. From the analysis, the root cause of delamination at the interface between molding compound and leadframe was due to additional tin and lead on the leadframe surface.